74HC157N,652 vs CD74HC157E96 feature comparison

74HC157N,652 NXP Semiconductors

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CD74HC157E96 Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, SOT38-4, DIP-16 DIP,
Pin Count 16 16
Manufacturer Package Code SOT38-4
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
kg CO2e/kg 12.6 12.6
Average Weight (mg) 1187.4 1187.4
CO2e (mg) 14961.241 14961.241
Total Weight 940.56
Category CO2 Kg 12.6 12.6
CO2 11851.055999999999
Compliance Temperature Grade Automotive: -40C to +125C Military: -55C to +125C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2020-01-16
CAS Accounted for Wt 85
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 1309-64-4, 7440-02-0
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V4.01b
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e4
Length 21.6 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method BULK
Prop. Delay@Nom-Sup 38 ns
Propagation Delay (tpd) 38 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.7 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
parentfamilyid 888557

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