74HC157D,653 vs MC74HC157ADR2 feature comparison

74HC157D,653 Nexperia

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MC74HC157ADR2 Motorola Mobility LLC

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA MOTOROLA INC
Part Package Code SOP SOIC
Package Description SOP-16 SOP, SOP16,.25
Pin Count 16 16
Manufacturer Package Code SOT109-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Date Of Intro 1993-11-01
Samacsys Manufacturer Nexperia
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 9.9 mm 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR, 13 INCH TR
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 38 ns 33 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 1 1
Max I(ol) 0.006 A
Package Equivalence Code SOP16,.25
Prop. Delay@Nom-Sup 32 ns

Compare 74HC157D,653 with alternatives

Compare MC74HC157ADR2 with alternatives