74HC154PW,118
vs
74HCT154D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
TSSOP2
Package Description
4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24
Pin Count
24
Manufacturer Package Code
SOT355-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
2 ENABLE INPUTS
Family
HC/UH
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G24
R-PDSO-G24
JESD-609 Code
e4
Length
7.8 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP24,.25
SOP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
45 ns
53 ns
Propagation Delay (tpd)
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
Base Number Matches
2
4
ECCN Code
EAR99
Compare 74HC154PW,118 with alternatives
74HC154PW,118 vs 74HC154PW-T
74HC154PW,118 vs M74HC154TTR
74HC154PW,118 vs 935182580112
74HC154PW,118 vs 74HC154PW
74HC154PW,118 vs MM74HC154MTCX
74HC154PW,118 vs MM74HC154MTC
74HC154PW,118 vs 74HC154PW,112
74HC154PW,118 vs 74HCT154DB,112
74HC154PW,118 vs 74HC154D,652