74HC154D,653 vs CD74HC154M96 feature comparison

74HC154D,653 NXP Semiconductors

Buy Now Datasheet

CD74HC154M96 Harris Semiconductor

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code SOP
Package Description 7.50 MM, PLASTIC, MS-013, SOT137-1, SOP-24
Pin Count 24
Manufacturer Package Code SOT137-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e0
Length 15.4 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP24,.4 SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns 44 ns
Propagation Delay (tpd) 225 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm
Base Number Matches 2 4
ECCN Code EAR99

Compare 74HC154D,653 with alternatives