74HC139DB vs 74LCX138SJ feature comparison

74HC139DB NXP Semiconductors

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74LCX138SJ onsemi

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code SOIC
Package Description SSOP, SSOP16,.3 SOP-16
Pin Count 16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LVC/LCX/Z
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e3
Length 6.2 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 44 ns 6 ns
Propagation Delay (tpd) 44 ns 7.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 5
Manufacturer Package Code 565BF
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Packing Method RAIL

Compare 74HC139DB with alternatives

Compare 74LCX138SJ with alternatives