74HC138PW,112
vs
74LCX138SJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSSOP
Package Description
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
0.300 INCH, EIAJ TYPE2, PLASTIC, SOIC-16
Pin Count
16
Manufacturer Package Code
SOT403-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Additional Feature
3 ENABLE INPUTS
THREE ENABLE INPUTS
Family
HC/UH
LVC/LCX/Z
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
5 mm
10.11 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.024 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP16,.25
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
45 ns
6 ns
Propagation Delay (tpd)
225 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
2.108 mm
Supply Voltage-Max (Vsup)
6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
4.4 mm
5.3 mm
Base Number Matches
2
5
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