74HC132D
vs
MM74HC132N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOT-108-1, SO-14
|
DIP, DIP14,.3
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
JESD-609 Code |
e4
|
e0
|
Length |
8.65 mm
|
19.18 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
0.004 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP14,.25
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Packing Method |
BULK
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
31 ns
|
32 ns
|
Propagation Delay (tpd) |
38 ns
|
32 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
YES
|
YES
|
Seated Height-Max |
1.75 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
16
|
3
|
|
|
|
Compare 74HC132D with alternatives
Compare MM74HC132N with alternatives