74HC08BQ,115
vs
5962R9665001V9A
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
QFN
|
|
| Package Description |
DHVQFN-14
|
DIE,
|
| Pin Count |
14
|
|
| Manufacturer Package Code |
SOT762-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1993-01-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
HC/UH
|
4000/14000/40000
|
| JESD-30 Code |
R-PQCC-N14
|
X-XUUC-N14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
3 mm
|
|
| Logic IC Type |
AND GATE
|
AND-OR GATE
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
1
|
| Number of Inputs |
2
|
8
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
DIE
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
UNCASED CHIP
|
| Packing Method |
TR, 7 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
135 ns
|
810 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
1
|
1
|
| Output Characteristics |
|
3-STATE
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
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