74HC04N,652
vs
74HC04DB-Q100J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
DIP
SSOP1
Package Description
0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14
5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count
14
14
Manufacturer Package Code
SOT27-1
SOT337-1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e4
Length
19.025 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.004 A
0.004 A
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SSOP
Package Equivalence Code
DIP14,.3
SSOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TUBE
Prop. Delay@Nom-Sup
26 ns
26 ns
Propagation Delay (tpd)
130 ns
130 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
4.2 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
5.3 mm
Base Number Matches
1
2
Screening Level
AEC-Q100
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