74HC03PW,653 vs 74HC03DB,112 feature comparison

74HC03PW,653 NXP Semiconductors

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74HC03DB,112 NXP Semiconductors

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, SOT-337-1, SSOP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 29 ns 29 ns
Seated Height-Max 1.1 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.3 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code SSOP1
Pin Count 14
Manufacturer Package Code SOT337-1
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC03DB,112 with alternatives