74HC00N,652
vs
SN74HC00N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
ROHS COMPLIANT, PLASTIC, DIP-14
Pin Count
14
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e4
e4
Length
19.025 mm
19.305 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
BULK
Prop. Delay@Nom-Sup
27 ns
Propagation Delay (tpd)
135 ns
115 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
4.2 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 74HC00N,652 with alternatives
Compare SN74HC00N with alternatives