74HC00N,652
vs
M38510/65001BCX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
DIP,
Pin Count
14
14
Manufacturer Package Code
SOT27-1
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
JESD-609 Code
e4
Length
19.025 mm
19.56 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
BULK
Prop. Delay@Nom-Sup
27 ns
21 ns
Propagation Delay (tpd)
135 ns
135 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
4.2 mm
5.08 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Power Supply Current-Max (ICC)
0.01 mA
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Compare 74HC00N,652 with alternatives
Compare M38510/65001BCX with alternatives