74FST3126QSR
vs
FST3126QSCX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ONSEMI
ON SEMICONDUCTOR
Part Package Code
SOIC
Package Description
QSOP-16
LSSOP, SSOP16,.25
Pin Count
16
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
4.89 mm
4.9 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Moisture Sensitivity Level
1
1
Number of Bits
1
1
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
LSSOP
Package Equivalence Code
SSOP16,.25
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, LOW PROFILE
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Seated Height-Max
1.73 mm
1.727 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4 V
4 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
3.9116 mm
3.9 mm
Base Number Matches
2
3
Control Type
ENABLE HIGH
Load Capacitance (CL)
50 pF
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
0.003 mA
Prop. Delay@Nom-Sup
0.25 ns
Time@Peak Reflow Temperature-Max (s)
40
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