74FCT521CTQG8
vs
5962-88543022X
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
QP SEMICONDUCTOR INC
|
Part Package Code |
QSOP
|
QFN
|
Package Description |
QSOP-20
|
QCCN,
|
Pin Count |
20
|
20
|
Manufacturer Package Code |
PCG20
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
1988-01-01
|
|
Additional Feature |
CASCADABLE
|
CASCADABLE
|
Family |
FCT
|
FCT
|
JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N20
|
JESD-609 Code |
e3
|
|
Length |
8.65 mm
|
8.89 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
IDENTITY COMPARATOR
|
IDENTITY COMPARATOR
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SSOP
|
QCCN
|
Package Equivalence Code |
SSOP20,.25
|
LCC20,.35SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, SHRINK PITCH
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
4.5 ns
|
9.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
2.54 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.635 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9116 mm
|
8.89 mm
|
Base Number Matches |
2
|
1
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare 74FCT521CTQG8 with alternatives
Compare 5962-88543022X with alternatives