74F779SDC vs 54F779/BFA feature comparison

74F779SDC Fairchild Semiconductor Corporation

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54F779/BFA YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, ,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO OUTPUT; MULTIPLEXED I/O
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family F/FAST F/FAST
JESD-30 Code R-CDIP-T16 R-CDFP-F16
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Propagation Delay (tpd) 22 ns 11.5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE FLAT
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 100 MHz 110 MHz
Base Number Matches 2 1
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 128 mA

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Compare 54F779/BFA with alternatives