74F259SDC
vs
933739430623
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
SOIC
Package Description
DIP,
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH
Family
F/FAST
F/FAST
JESD-30 Code
R-CDIP-T16
R-PDSO-G16
Logic IC Type
D LATCH
J-KBAR FLIP-FLOP
Number of Bits
1
1
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
7 ns
9.2 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
POSITIVE EDGE
Base Number Matches
2
1
Rohs Code
JESD-609 Code
e4
Length
9.9 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.75 mm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.9 mm
fmax-Min
90 MHz
Compare 74F259SDC with alternatives
Compare 933739430623 with alternatives