74F257APC vs I74F257AD,118 feature comparison

74F257APC Texas Instruments

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I74F257AD,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP SOP
Package Description 0.300 INCH, PLASTIC, DIP-16 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.305 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 4 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 6 ns 10.5 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 1
Rohs Code Yes
Manufacturer Package Code SOT109-1
JESD-609 Code e4
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 23 mA
Prop. Delay@Nom-Sup 10.5 ns
Qualification Status Not Qualified
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74F257APC with alternatives

Compare I74F257AD,118 with alternatives