74F253PC vs N74F253N feature comparison

74F253PC Texas Instruments

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N74F253N NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-16 PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.305 mm 19.025 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 2
Number of Inputs 8 4
Number of Outputs 2 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 8 ns 8 ns
Seated Height-Max 5.08 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 4
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 23 mA
Prop. Delay@Nom-Sup 12 ns
Qualification Status Not Qualified
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 40

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