74F219AN
vs
AM27LS03-25PC
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP,
|
,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
8 ns
|
25 ns
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
Length |
19.025 mm
|
19.05 mm
|
Memory Density |
64 bit
|
64 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
16
|
16
|
Number of Words |
16 words
|
16 words
|
Number of Words Code |
16
|
16
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Organization |
16X4
|
16X4
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.2 mm
|
5.08 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
2
|
I/O Type |
|
SEPARATE
|
Package Equivalence Code |
|
DIP16,.3
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Standby Voltage-Min |
|
4.75 V
|
Supply Current-Max |
|
0.035 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 74F219AN with alternatives
Compare AM27LS03-25PC with alternatives