74F175AD
vs
IDT74LVC112APGG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP,
|
TSSOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
9.9 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
J-K FLIP-FLOP
|
| Number of Bits |
4
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Power Supply Current-Max (ICC) |
31 mA
|
|
| Propagation Delay (tpd) |
9 ns
|
7.1 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
NEGATIVE EDGE
|
| Width |
3.9 mm
|
4.4 mm
|
| fmax-Min |
125 MHz
|
150 MHz
|
| Base Number Matches |
11
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Output Characteristics |
|
3-STATE
|
|
|
|
Compare 74F175AD with alternatives
Compare IDT74LVC112APGG with alternatives