74F157N
vs
N74F157AN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP-16
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
23 mA
|
23 mA
|
| Propagation Delay (tpd) |
9 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e4
|
| Length |
|
19.025 mm
|
| Max I(ol) |
|
0.02 A
|
| Package Equivalence Code |
|
DIP16,.3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
7 ns
|
| Seated Height-Max |
|
4.2 mm
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
7.62 mm
|
|
|
|
Compare 74F157N with alternatives
Compare N74F157AN with alternatives