74F11D
vs
N74F11D,623
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS COMPONENTS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
3
|
3
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
9.7 mA
|
9.7 mA
|
| Propagation Delay (tpd) |
6.5 ns
|
6.6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
PLASTIC, MS-012AB, SOT108-1, SOP-14
|
| Pin Count |
|
14
|
| Manufacturer Package Code |
|
SOT108-1
|
| Factory Lead Time |
|
4 Weeks
|
| JESD-609 Code |
|
e4
|
| Length |
|
8.65 mm
|
| Max I(ol) |
|
0.02 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP14,.25
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
6.6 ns
|
| Schmitt Trigger |
|
NO
|
| Seated Height-Max |
|
1.75 mm
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3.9 mm
|
|
|
|
Compare 74F11D with alternatives
Compare N74F11D,623 with alternatives