Findchips: Compare 74F112SDCQR vs I74F112N,602

74F112SDCQR vs I74F112N,602 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	FAIRCHILD SEMICONDUCTOR CORP	NXP SEMICONDUCTORS
Part Package Code	DIP	DIP
Package Description	DIP,	DIP, DIP16,.3
Pin Count	16	16
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	F/FAST	F/FAST
JESD-30 Code	R-CDIP-T16	R-PDIP-T16
Logic IC Type	J-K FLIP-FLOP	J-K FLIP-FLOP
Number of Bits	2	2
Number of Functions	2	2
Number of Terminals	16	16
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Output Polarity	COMPLEMENTARY	COMPLEMENTARY
Package Body Material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Propagation Delay (tpd)	7.5 ns	7.5 ns
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.25 V	5.5 V
Supply Voltage-Min (Vsup)	4.75 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	TTL	TTL
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Trigger Type	NEGATIVE EDGE	NEGATIVE EDGE
fmax-Min	130 MHz	80 MHz
Base Number Matches	1	1
Rohs Code		Yes
JESD-609 Code		e4
Length		19.025 mm
Load Capacitance (CL)		50 pF
Max Frequency@Nom-Sup		80000000 Hz
Max I(ol)		0.02 A
Package Equivalence Code		DIP16,.3
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Power Supply Current-Max (ICC)		21 mA
Seated Height-Max		4.2 mm
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch		2.54 mm
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
Width		7.62 mm
	Logic » FF/Latches	Logic » FF/Latches