Findchips: Compare 74CBTLV1G125GV vs 74CBTLV1G125GM,115

74CBTLV1G125GV vs 74CBTLV1G125GM,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Package Description	TSSOP,	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	CBTLV/3B	CBTLV/3B
JESD-30 Code	R-PDSO-G5	R-PDSO-N6
JESD-609 Code	e3	e3
Length	2.9 mm	1.45 mm
Logic IC Type	BUS DRIVER	BUS DRIVER
Moisture Sensitivity Level	1	1
Number of Bits	1	1
Number of Functions	1	1
Number of Ports	2	2
Number of Terminals	5	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	3-STATE	3-STATE
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	VSON
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	0.39 ns	0.39 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	0.5 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	3.3 V	2.7 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	TIN	Tin (Sn)
Terminal Form	GULL WING	NO LEAD
Terminal Pitch	0.95 mm	0.5 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Width	1.5 mm	1 mm
Base Number Matches	2	2
Part Package Code		SON
Pin Count		6
Manufacturer Package Code		SOT886
Factory Lead Time		4 Weeks
Package Equivalence Code		SOLCC6,.04,20
	Logic » Bus Driver/Transceivers	Logic » Bus Driver/Transceivers