74CBTLV1G125GM
vs
TC7SBL385FU
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
Part Package Code |
SON
|
SSOP
|
Package Description |
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
|
TSSOP, TSSOP6,.08
|
Pin Count |
6
|
5
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CBTLV/3B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e0
|
Length |
1.45 mm
|
2 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
6
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Equivalence Code |
SOLCC6,.04,20
|
TSSOP6,.08
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
0.39 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1 mm
|
1.25 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 74CBTLV1G125GM with alternatives
Compare TC7SBL385FU with alternatives