74CBT16232DGGRE4
vs
TC7MBL3257AFK
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TOSHIBA CORP
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
TSSOP, TSSOP56,.3,20
|
VSSOP, TSSOP16,.16,20
|
Pin Count |
56
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CBT/FST/QS/5C/B
|
CBT/FST/QS/5C/B
|
JESD-30 Code |
R-PDSO-G56
|
R-PDSO-G16
|
JESD-609 Code |
e4
|
e0
|
Length |
14 mm
|
4 mm
|
Logic IC Type |
MULTIPLEXER AND DEMUX/DECODER
|
MULTIPLEXER AND DEMUX/DECODER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
16
|
4
|
Number of Inputs |
1
|
1
|
Number of Outputs |
2
|
2
|
Number of Terminals |
56
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VSSOP
|
Package Equivalence Code |
TSSOP56,.3,20
|
TSSOP16,.16,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
0.35 ns
|
0.52 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
6.1 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 74CBT16232DGGRE4 with alternatives
Compare TC7MBL3257AFK with alternatives