74AVC4T245D-Q100
vs
74AVC4T245PW,112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT109-1, SOP-16
|
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Family |
AVC
|
AVC
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
9.9 mm
|
5 mm
|
| Logic IC Type |
BUS TRANSCEIVER
|
BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Propagation Delay (tpd) |
10.4 ns
|
14.5 ns
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
1.75 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
SOT403-1
|
| Control Type |
|
COMMON CONTROL
|
| Count Direction |
|
BIDIRECTIONAL
|
| JESD-609 Code |
|
e4
|
| Load Capacitance (CL) |
|
15 pF
|
| Max I(ol) |
|
0.006 A
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Packing Method |
|
TUBE
|
| Prop. Delay@Nom-Sup |
|
10.4 ns
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
NICKEL PALLADIUM
|
|
|
|