74AVC1T45GM-Q100 vs 74AVC1T45GM,132 feature comparison

74AVC1T45GM-Q100 NXP Semiconductors

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74AVC1T45GM,132 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON SON
Package Description VSON, 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AVC AVC
JESD-30 Code R-PDSO-N6 R-XDSO-N6
Length 1.45 mm 1.45 mm
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 1 2
Number of Functions 1 2
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VSON VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Propagation Delay (tpd) 9.9 ns 15.5 ns
Screening Level AEC-Q100
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 1 mm 1 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT886
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
JESD-609 Code e3
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9.9 ns
Qualification Status Not Qualified
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74AVC1T45GM,132 with alternatives