74AVC16834DGG vs 74AVC16834ADGV,112 feature comparison

74AVC16834DGG NXP Semiconductors

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74AVC16834ADGV,112 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, 4.40 MM, 0.40 MM PITCH, PLASTIC, SOT-481-2, TVSOP-56
Pin Count 56 56
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AVC AVC
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e4 e4
Length 14 mm 11.3 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 18 18
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 4.5 ns 5.1 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.4 mm
Terminal Position DUAL DUAL
Width 6.1 mm 4.4 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT481-2
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Load Capacitance (CL) 30 pF
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP56,.25,16
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 2.5 ns
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74AVC16834ADGV,112 with alternatives