74AUP2G38DC,125
vs
74AUP2G38DC
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
Part Package Code |
SSOP
|
|
Package Description |
2.30 MM, ROHS COMPLIANT, PLASTIC, MO-187, SOT-765-1, VSSOP-8
|
VSSOP,
|
Pin Count |
8
|
|
Manufacturer Package Code |
SOT765-1
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Nexperia
|
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e4
|
e4
|
Length |
2.3 mm
|
2.3 mm
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Inputs |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
VSSOP
|
Package Equivalence Code |
TSSOP8,.12,20
|
TSSOP8,.12,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR, 7 INCH
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
24 ns
|
24 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
2 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare 74AUP2G38DC,125 with alternatives
Compare 74AUP2G38DC with alternatives