74AUP2G34GW,125 vs NC7WZ17L6X feature comparison

74AUP2G34GW,125 NXP Semiconductors

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NC7WZ17L6X Fairchild Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FAIRCHILD SEMICONDUCTOR CORP
Part Package Code TSSOP MICROPAK MLP
Package Description PLASTIC, SC-88, SOT-363, SMT-6 PIN 1 MM, ROHS COMPLIANT, MO-252UAAD, MICROPAK-6
Pin Count 6 6
Manufacturer Package Code SOT363 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-N6
JESD-609 Code e3 e4
Length 2 mm 1.45 mm
Load Capacitance (CL) 30 pF 50 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0017 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1 2
Number of Inputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP6,.08 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 20.8 ns 7.3 ns
Propagation Delay (tpd) 20.8 ns 15.8 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1.1 mm 0.55 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 1.65 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Pbfree Code Yes
ECCN Code EAR99
Packing Method TR
Supply Voltage-Nom (Vsup) 1.8 V

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