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74AUP2G32DC vs 74AUP3G04GT,115 feature comparison

74AUP2G32DC NXP Semiconductors

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74AUP3G04GT,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SON
Package Description 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G8 R-PDSO-N8
Length 2.3 mm 1.95 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type OR GATE INVERTER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 3
Number of Inputs 2 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSON
Package Equivalence Code TSSOP8,.12,20 SOLCC8,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 23.7 ns 20.9 ns
Propagation Delay (tpd) 23.7 ns 20.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1 mm
Base Number Matches 3 1
Manufacturer Package Code SOT833-1
JESD-609 Code e3
Terminal Finish Tin (Sn)
Logic » Gates
Logic » Gates

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