74AUP2G157GT
vs
74AUP2G157GM
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NEXPERIA
|
Part Package Code |
SON
|
|
Package Description |
1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT883-1, SON-8
|
VQCCN,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-N8
|
S-PQCC-N8
|
JESD-609 Code |
e3
|
e4
|
Length |
1.95 mm
|
1.6 mm
|
Load Capacitance (CL) |
30 pF
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.0017 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
VQCCN
|
Package Equivalence Code |
LCC8,.06SQ,20
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
22.8 ns
|
|
Propagation Delay (tpd) |
22.8 ns
|
22.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
1.1 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1 mm
|
1.6 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare 74AUP2G157GT with alternatives
Compare 74AUP2G157GM with alternatives