74AUP2G157GM,125 vs 74AUP2G157GM feature comparison

74AUP2G157GM,125 NXP Semiconductors

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74AUP2G157GM NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, XQFN-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Manufacturer Package Code SOT902-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PQCC-N8 S-PQCC-N8
JESD-609 Code e4
Length 1.6 mm 1.6 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VQCCN
Package Equivalence Code LCC8,.06SQ,20 SOLCC8,.04,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 22.8 ns 22.8 ns
Propagation Delay (tpd) 22.8 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 1.6 mm
Base Number Matches 1 3

Compare 74AUP2G157GM,125 with alternatives

Compare 74AUP2G157GM with alternatives