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74AUP2G157DC-G vs 74AUP1G158GM,115 feature comparison

74AUP2G157DC-G NXP Semiconductors

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74AUP1G158GM,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SON
Package Description 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
Pin Count 8 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G8 R-PDSO-N6
JESD-609 Code e4 e3
Length 2.3 mm 1.45 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP VSON
Package Equivalence Code TSSOP8,.12,20 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Prop. Delay@Nom-Sup 22.8 ns 21 ns
Propagation Delay (tpd) 22.8 ns 21 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 2 mm 1 mm
Base Number Matches 1 2
Manufacturer Package Code SOT886
Factory Lead Time 4 Weeks
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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