74AUP2G157DC-G
vs
NC7SV157P6X_NL
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
|
TSSOP, TSSOP6,.08
|
Pin Count |
8
|
6
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G6
|
JESD-609 Code |
e4
|
e3
|
Length |
2.3 mm
|
2 mm
|
Load Capacitance (CL) |
30 pF
|
15 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.0017 A
|
0.002 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
6
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP8,.12,20
|
TSSOP6,.08
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
TR
|
Prop. Delay@Nom-Sup |
22.8 ns
|
18.8 ns
|
Propagation Delay (tpd) |
22.8 ns
|
18.8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.9 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
2 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 74AUP2G157DC-G with alternatives
Compare NC7SV157P6X_NL with alternatives