74AUP2G157DC vs NC7SV157P6X_NL feature comparison

74AUP2G157DC Nexperia

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NC7SV157P6X_NL Fairchild Semiconductor Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA FAIRCHILD SEMICONDUCTOR CORP
Package Description VSSOP, TSSOP, TSSOP6,.08
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G8 R-PDSO-G6
JESD-609 Code e4 e3
Length 2.3 mm 2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 8 6
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 22.8 ns 18.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.9 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2 mm 1.25 mm
Base Number Matches 2 1
Part Package Code SOIC
Pin Count 6
Load Capacitance (CL) 15 pF
Max I(ol) 0.002 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Prop. Delay@Nom-Sup 18.8 ns

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