74AUP2G157DC vs 74AUP1G18GW feature comparison

74AUP2G157DC Nexperia

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74AUP1G18GW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description VSSOP, PLASTIC, SOT-363, SC-88, SMT-6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G8 R-PDSO-G6
JESD-609 Code e4 e3
Length 2.3 mm 2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER AND DEMUX/DECODER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 1
Number of Outputs 1 2
Number of Terminals 8 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 22.8 ns 18.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.25 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code SOT-363
Pin Count 6
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Output Characteristics 3-STATE
Packing Method TR
Prop. Delay@Nom-Sup 18.9 ns

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