74AUP2G157DC,125 vs NC7SV158L6X feature comparison

74AUP2G157DC,125 NXP Semiconductors

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NC7SV158L6X onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SSOP
Package Description 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8 ,
Pin Count 8
Manufacturer Package Code SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V
JESD-30 Code R-PDSO-G8
JESD-609 Code e4
Length 2.3 mm
Load Capacitance (CL) 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 2
Number of Outputs 1
Number of Terminals 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY
Package Code VSSOP
Package Equivalence Code TSSOP8,.12,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 22.8 ns
Propagation Delay (tpd) 22.8 ns
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 2 mm
Base Number Matches 2 3
Factory Lead Time 4 Weeks

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