74AUP2G157DC,125
vs
NC7SV158L6X
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ON SEMICONDUCTOR
Part Package Code
SSOP
Package Description
2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
,
Pin Count
8
Manufacturer Package Code
SOT765-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
JESD-30 Code
R-PDSO-G8
JESD-609 Code
e4
Length
2.3 mm
Load Capacitance (CL)
30 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.0017 A
Moisture Sensitivity Level
1
Number of Functions
1
Number of Inputs
2
Number of Outputs
1
Number of Terminals
8
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Output Polarity
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
Package Code
VSSOP
Package Equivalence Code
TSSOP8,.12,20
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
22.8 ns
Propagation Delay (tpd)
22.8 ns
Qualification Status
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
Supply Voltage-Nom (Vsup)
1.2 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
2 mm
Base Number Matches
2
3
Factory Lead Time
4 Weeks
Compare 74AUP2G157DC,125 with alternatives
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74AUP2G157DC,125 vs 74AUP2G157DC
74AUP2G157DC,125 vs NC7SV158P6X
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74AUP2G157DC,125 vs 74AUP1G18GM,132