74AUP2G126GT,115 vs 74AUP2G125GM,125 feature comparison

74AUP2G126GT,115 NXP Semiconductors

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74AUP2G125GM,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON QFN
Package Description 1 X 1.95 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, SON-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1. QFN-8
Pin Count 8 8
Manufacturer Package Code SOT833-1 SOT902-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE HIGH ENABLE LOW
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N8 S-PBCC-B8
JESD-609 Code e3 e4
Length 1.95 mm 1.6 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VBCC
Package Equivalence Code SOLCC8,.04,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 24 ns 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD BUTT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.6 mm
Base Number Matches 2 2

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