74AUP2G125GF vs 74AUP2G126GM,125 feature comparison

74AUP2G125GF NXP Semiconductors

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74AUP2G126GM,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON QFN
Package Description 1.35 X 1 MM, 0.50 MM HEIGHT, MO-252, SOT-1089, SON-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1. QFN-8
Pin Count 8 8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N8 S-PBCC-B8
JESD-609 Code e3 e4
Length 1.35 mm 1.6 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VBCC
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD BUTT
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1 mm 1.6 mm
Base Number Matches 2 2
Manufacturer Package Code SOT902-2
Control Type ENABLE HIGH
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code LCC8,.06SQ,20
Packing Method TR
Prop. Delay@Nom-Sup 24 ns

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Compare 74AUP2G126GM,125 with alternatives