74AUP2G08GM,125
vs
74AUP2G08GM
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NEXPERIA
NXP SEMICONDUCTORS
Part Package Code
QFN
QFN
Package Description
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
1.6 X 1.6 MM, 0.5 MM HEIGHT, MO-255, SOT902-1, QFN-8U
Pin Count
8
8
Manufacturer Package Code
SOT902-2
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Nexperia
Family
AUP/ULP/V
AUP/ULP/V
JESD-30 Code
S-PQCC-N8
S-PQCC-N8
JESD-609 Code
e4
e4
Length
1.6 mm
1.6 mm
Logic IC Type
AND GATE
AND GATE
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VQCCN
VQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, VERY THIN PROFILE
CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Propagation Delay (tpd)
24 ns
24 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.5 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
0.8 V
0.8 V
Supply Voltage-Nom (Vsup)
1.2 V
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.55 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.6 mm
1.6 mm
Base Number Matches
1
3
Load Capacitance (CL)
30 pF
Max I(ol)
0.0017 A
Package Equivalence Code
LCC8,.06SQ,20
Packing Method
TR
Prop. Delay@Nom-Sup
24 ns
Schmitt Trigger
NO
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