74AUP2G08GD vs 74AUP2G08GM feature comparison

74AUP2G08GD NXP Semiconductors

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74AUP2G08GM NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON QFN
Package Description 3 X 2 MM, 0.5 MM HEIGHT, SOT996-2, SON-8U 1.6 X 1.6 MM, 0.5 MM HEIGHT, MO-255, SOT902-1, QFN-8U
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N8 S-PQCC-N8
JESD-609 Code e4 e4
Length 3 mm 1.6 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VQCCN
Package Equivalence Code SOLCC8,.11,20 LCC8,.06SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 24 ns 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.55 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2 mm 1.6 mm
Base Number Matches 2 2

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