74AUP2G07GW
vs
NC7ST08L6X
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
SOT-363
MICROPAK MLP
Package Description
PLASTIC, SOT-363, SC-88, 6 PIN
1 MM, MICROPAK-6
Pin Count
6
6
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
HST/T
JESD-30 Code
R-PDSO-G6
R-PDSO-N6
JESD-609 Code
e3
e4
Length
2 mm
1.45 mm
Load Capacitance (CL)
30 pF
50 pF
Logic IC Type
BUFFER
AND GATE
Max I(ol)
0.0017 A
0.002 A
Moisture Sensitivity Level
1
1
Number of Functions
2
1
Number of Inputs
1
2
Number of Terminals
6
6
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSON
Package Equivalence Code
TSSOP6,.08
SOLCC6,.04,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
20.7 ns
31 ns
Propagation Delay (tpd)
20.7 ns
31 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
0.55 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
0.8 V
4.5 V
Supply Voltage-Nom (Vsup)
1.1 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Tin (Sn)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.25 mm
1 mm
Base Number Matches
2
3
Manufacturer Package Code
6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
ECCN Code
EAR99
Compare 74AUP2G07GW with alternatives
Compare NC7ST08L6X with alternatives