Findchips: Compare 74AUP2G07GW,125 vs 74AUPG04DTR

74AUP2G07GW,125 vs 74AUPG04DTR feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	STMICROELECTRONICS
Part Package Code	TSSOP	DFN
Package Description	PLASTIC, SC-88, SOT-363, SMT-6	VSON,
Pin Count	6	6
Manufacturer Package Code	SOT363
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	AUP/ULP/V	AUP/ULP/V
JESD-30 Code	R-PDSO-G6	R-XDSO-N6
JESD-609 Code	e3
Length	2 mm	1.2 mm
Load Capacitance (CL)	30 pF
Logic IC Type	BUFFER	INVERTER
Max I(ol)	0.0017 A
Moisture Sensitivity Level	1
Number of Functions	2	1
Number of Inputs	1	1
Number of Terminals	6	6
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	UNSPECIFIED
Package Code	TSSOP	VSON
Package Equivalence Code	TSSOP6,.08
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE
Packing Method	TR	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	20.7 ns
Propagation Delay (tpd)	20.7 ns	16 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.1 mm	0.55 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	0.8 V	1.2 V
Supply Voltage-Nom (Vsup)	1.1 V	2.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Tin (Sn)
Terminal Form	GULL WING	NO LEAD
Terminal Pitch	0.65 mm	0.4 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.25 mm	1 mm
Base Number Matches	2	1
	Logic » Gates	Logic » Gates