74AUP1T45GW,125 vs 74AUP1T45GW feature comparison

74AUP1T45GW,125 NXP Semiconductors

Buy Now Datasheet

74AUP1T45GW Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP
Package Description PLASTIC, SOT363, SC-88, 6 PIN
Pin Count 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Control Type COMMON CONTROL ENABLE LOW/HIGH
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G6 R-PDSO-G6
JESD-609 Code e3 e3
Length 2 mm 2 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 40.5 ns
Propagation Delay (tpd) 40.5 ns 40.5 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 1.1 V 1.1 V
Supply Voltage-Nom (Vsup) 1.4 V 1.4 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Power Supply Current-Max (ICC) 50 mA

Compare 74AUP1T45GW,125 with alternatives

Compare 74AUP1T45GW with alternatives