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74AUP1G80GW vs 74AUP1G74GM,125 feature comparison

74AUP1G80GW NXP Semiconductors

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74AUP1G74GM,125 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOT QFN
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 XQFN-8
Pin Count 5 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 S-PQCC-N8
JESD-609 Code e3 e4
Length 2.05 mm 1.6 mm
Load Capacitance (CL) 30 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 5 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VQCCN
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 27.2 ns 23.3 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 40
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1.25 mm 1.6 mm
fmax-Min 510 MHz 510 MHz
Base Number Matches 2 2
Manufacturer Package Code SOT902-2
Samacsys Manufacturer Nexperia
Logic » FF/Latches
Logic » FF/Latches

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