74AUP1G80GM,132
vs
SN74AUP1G80DRY
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SON
|
|
| Package Description |
VSON, SOLCC6,.04,20
|
,
|
| Pin Count |
6
|
|
| Manufacturer Package Code |
SOT886
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AUP/ULP/V
|
|
| JESD-30 Code |
R-PDSO-N6
|
|
| JESD-609 Code |
e3
|
|
| Length |
1.45 mm
|
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max I(ol) |
0.0017 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
6
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VSON
|
|
| Package Equivalence Code |
SOLCC6,.04,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
27.2 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.5 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
|
| Supply Voltage-Nom (Vsup) |
1.2 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
1 mm
|
|
| fmax-Min |
510 MHz
|
|
| Base Number Matches |
2
|
1
|
|
|
|
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