Findchips: Compare 74AUP1G74GM vs 74AUP1G79GM,115

74AUP1G74GM vs 74AUP1G79GM,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Not Recommended	Active
Ihs Manufacturer	NEXPERIA	NEXPERIA
Package Description	QFN-8	SON-6
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	AUP/ULP/V	AUP/ULP/V
JESD-30 Code	S-PQCC-N8	R-PDSO-N6
JESD-609 Code	e4	e3
Length	1.6 mm	1.45 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Moisture Sensitivity Level	1	1
Number of Bits	1	1
Number of Functions	1	1
Number of Terminals	8	6
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Polarity	COMPLEMENTARY	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	VSON
Package Shape	SQUARE	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	23.3 ns	25.6 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	0.5 mm	0.5 mm
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	0.8 V	0.8 V
Supply Voltage-Nom (Vsup)	1.1 V	1.1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	TIN
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	DUAL
Time@Peak Reflow Temperature-Max (s)	30	30
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	1.6 mm	1 mm
fmax-Min	510 MHz	510 MHz
Base Number Matches	2	1
Part Package Code		SON
Pin Count		6
Manufacturer Package Code		SOT886
Samacsys Manufacturer		Nexperia
Packing Method		TR, 7 INCH
	Logic » FF/Latches	Logic » FF/Latches