74AUP1G74DC vs 74AUP1G80GW feature comparison

74AUP1G74DC NXP Semiconductors

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74AUP1G80GW NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOT
Package Description 2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Pin Count 8 5
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G8 R-PDSO-G5
JESD-609 Code e4 e3
Length 2.3 mm 2.05 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 70000000 Hz
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 8 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSSOP
Package Equivalence Code TSSOP8,.12,20 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 23.3 ns 27.2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 2 mm 1.25 mm
fmax-Min 510 MHz 510 MHz
Base Number Matches 6 3

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